ENIG
ENIG provides a flat pad surface and is often selected for fine pitch components and gold contact requirements.
Surface Finish
Surface finish selection affects pad flatness, solderability, assembly compatibility, storage and product reliability.
ENIG provides a flat pad surface and is often selected for fine pitch components and gold contact requirements.
HASL is a common solderable finish for many standard PCB applications. Lead Free HASL is used for lead-free assembly needs.
OSP protects copper with an organic coating and should be reviewed with storage and assembly timing.
| Finish | Advantages | Applications |
|---|---|---|
| ENIG | Flat pads and strong solderability | Fine pitch, BGA and higher density boards |
| HASL | Common and robust solderable surface | General electronics and many FR4 PCB projects |
| OSP | Simple copper protection | Projects with controlled assembly timing |
Send assembly requirements, pad geometry and product environment notes.