Engineering file review
Gerber files, drill data, outline, layer stack, material, finish and special notes are checked for manufacturing readiness.
Manufacturing Process
YBCPCB presents a factory-oriented process for professional PCB buyers who need clear production steps, inspection checkpoints and file preparation guidance before sending a manufacturing inquiry.
Gerber files, drill data, outline, layer stack, material, finish and special notes are checked for manufacturing readiness.
Inner copper layers are imaged, developed and etched before inspection and lamination preparation for multilayer PCB projects.
Core, prepreg and copper foil are stacked and pressed according to the approved layer structure and board thickness requirement.
Through holes, vias and slots are drilled according to the drill file, with tool selection reviewed against board thickness and copper weight.
Hole walls and outer copper are plated to build electrical connection between layers and prepare the panel for outer layer imaging.
Photo imaging, developing and etching create the outer copper circuitry before solder mask and finish operations.
Automated optical inspection checks copper features for opens, shorts, spacing issues and pattern defects during production.
HASL, Lead Free HASL, ENIG, OSP or Immersion Silver is selected according to assembly method and application requirements.
Electrical testing, visual inspection, dimensional checks and packing review are completed before shipment preparation.
Factory Evidence
These sections reserve professional placements for verified factory photos, production equipment, inspection equipment and PCB samples.
Production floor and panel handling images can be added when verified media is available.
Imaging, drilling, plating, lamination and routing equipment sections support factory credibility.
AOI, electrical testing and visual inspection areas show process control for PCB buyers.
Representative boards can help buyers understand multilayer, HDI, flexible and rigid-flex capabilities.
| Workflow stage | Manufacturing focus | Buyer review point |
|---|---|---|
| File review | Gerber, drill, outline, stackup, material and finish notes | Confirm complete manufacturing data before production planning. |
| Build process | Inner layer, lamination, drilling, plating, imaging and solder mask | Match process route to layer count, copper weight and board thickness. |
| Inspection | AOI, electrical test, visual inspection and final documentation | Align quality checkpoints with application and delivery requirements. |
Share manufacturing files, stackup notes, material needs and inspection requirements with the engineering team.