Prototype PCB
For design verification, sample builds and pre-production engineering checks.
PCB Capabilities
Use this page as a starting point for evaluating YBCPCB as a PCB manufacturer for FR4 PCB, multilayer PCB, HDI PCB, flexible PCB and export production programs.
| Category | Manufacturing parameter | Review note |
|---|---|---|
| Layer Count | 2-32 Layers | Final feasibility depends on stackup, board thickness, drill and process requirements. |
| Materials | FR-4, High Tg, Halogen Free, Metal Core | Material selection should match thermal, reliability and application requirements. |
| Surface Finish | HASL, Lead Free HASL, ENIG, OSP, Immersion Silver | Finish should be confirmed by assembly process, shelf life and customer standard. |
| Advanced Capabilities | Controlled impedance, HDI, fine line PCB, heavy copper PCB | Advanced requirements are reviewed from Gerber files, stackup and engineering notes. |
| Solder Mask | Green and common custom colors subject to order review | Color and ink requirements should be stated in the inquiry. |
| Testing | Electrical testing and visual inspection according to order type | Inspection expectations should be included with production or qualification needs. |
For design verification, sample builds and pre-production engineering checks.
For denser routing, controlled stackup planning and complex product designs.
For repeat orders requiring stable documentation and consistent production handling.
Detailed Capability Links
Use these supporting pages to prepare manufacturability questions before sending files to the engineering team.
For signal integrity, stackup and dielectric review.
For high density interconnect and compact layouts.
For power, LED and high-current applications.
For fine line, flex, rigid-flex and complex PCB review.