Layer and stackup review
Multilayer and HDI projects should include stackup notes, impedance needs and drill structure details.
Manufacturing Capability
PCB manufacturing capability for technical buyer review.
Use this capability overview to prepare layer count, material, board thickness, copper thickness, surface finish and testing requirements before contacting engineering.
| Capability item | Review range | Engineering note |
|---|---|---|
| Layer count | 2-32 layers by review | Confirm stackup, drilling and board thickness. |
| Material | FR-4, High Tg, Halogen Free, Metal Core, flexible materials | Select by thermal, mechanical and compliance requirements. |
| Board thickness | 0.4mm-3.5mm by structure review | Connector fit, rigidity and assembly process matter. |
| Copper thickness | 1oz-6oz by application review | High copper requires spacing and plating review. |
| Surface finish | HASL, Lead Free HASL, ENIG, OSP, Immersion Silver | Match finish with assembly and storage requirements. |
| Testing capability | AOI, electrical testing, visual inspection | Testing plan follows board type and application. |
Material and finish review
Material and finish should match product environment, assembly process and reliability expectations.
Testing review
Electrical testing, AOI and visual inspection expectations can be confirmed before production planning.
Review your PCB manufacturing requirements.
Send files, stackup notes, material requirements and quality expectations.