FR4 PCB
Common FR4 materials for standard electronic products, balancing electrical performance, availability and design priority.
PCB Materials
Material guidance for reliable FR4 and multilayer PCB builds.
Material choice affects thermal performance, dimensional stability, soldering behavior and long-term reliability. YBCPCB organizes material information to support faster inquiry decisions.
High Tg FR4
Recommended when operating temperature, assembly cycles or reliability requirements call for greater thermal stability.
Surface Finish
HASL lead-free, ENIG and other finishes can be reviewed based on solderability, shelf life and assembly process.
Material selection factors
- Layer count and stackup requirements for multilayer PCB designs.
- Operating temperature and soldering process conditions.
- Copper thickness needs for power, current carrying and thermal behavior.
- Final assembly method, component pitch and surface finish expectations.