Via structure
Microvia stack, stagger and drill strategy should be reviewed early for manufacturability.
HDI Design
HDI PCB design guidelines.
HDI PCB design needs careful planning for microvias, fine lines, BGA escape routing, material selection and inspection requirements.
Routing density
Fine trace and spacing requirements must be aligned with copper weight, finish and inspection capability.
Compact electronics
HDI PCB supports wearable, IoT, medical accessory and compact communication electronics.
| Review item | Engineering information | Related page |
|---|---|---|
| Files | Gerber, drill, outline, layer stack, material and finish notes. | PCB Design Guide |
| Capability | 2-32 Layers, 0.4mm-3.5mm board thickness, 1oz-6oz copper, FR-4, High Tg, Halogen Free and Metal Core options. | Manufacturing Capability |
| Quality | Electrical testing, AOI inspection, visual inspection and documentation by project requirement. | Quality Control |
Prepare your PCB project for engineering review.
Send files, layer information, material requirements and application notes to YBCPCB.