Multilayer PCB
Uses multiple copper layers laminated into one rigid board for higher routing density, ground planes and power distribution.
Technology Comparison
PCB technologies comparison for engineering selection.
Compare common PCB structures so buyers can decide which technology fits product size, routing density, mechanical needs and reliability requirements.
HDI PCB
Uses high density interconnect structures, fine lines and microvia planning for compact electronics.
Flexible PCB
Uses flexible base material for bendable, lightweight and space-constrained electronic assemblies.
Rigid-Flex PCB
Combines rigid and flexible areas to reduce connectors and support complex mechanical packaging.
When to choose
Choose by product size, bend requirements, component pitch, layer count, reliability needs and assembly method.
Engineering review
Send board files, mechanical drawings, stackup notes and application requirements before production planning.
| Engineering item | Manufacturing review | Related page |
|---|---|---|
| Files | Gerber, drill, outline, stackup and manufacturing notes. | Required files |
| Capability | Layer count, board thickness, copper, material and surface finish. | Capabilities |
| Quality | AOI, electrical testing, visual inspection and reliability review. | Quality Control |
Related engineering resources
Prepare your PCB project for engineering review.
Send manufacturing files, stackup details, material requirements and application notes.