Through hole vias
Connect layers through the full board thickness and are common in standard multilayer PCB designs.
Via Types
PCB via types explained for manufacturing review.
Via selection affects layer connection, routing density, drilling strategy, plating and inspection requirements.
Blind vias
Connect an outer layer to one or more inner layers and require careful stackup review.
Buried vias
Connect internal layers without reaching the outer surfaces and are used in advanced multilayer structures.
Microvias
Used in HDI PCB where compact routing and fine pitch components require high density interconnect design.
| Engineering item | Manufacturing review | Related page |
|---|---|---|
| Files | Gerber, drill, outline, stackup and manufacturing notes. | Required files |
| Capability | Layer count, board thickness, copper, material and surface finish. | Capabilities |
| Quality | AOI, electrical testing, visual inspection and reliability review. | Quality Control |
Related engineering resources
Prepare your PCB project for engineering review.
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