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Surface Finish Options

PCB surface finish options for solderability and assembly reliability.

Surface finish selection affects shelf life, solderability, fine-pitch assembly, design priority and product reliability.

Technical explanation

PCB surface finish protects exposed copper and prepares pads for assembly. Common choices include HASL lead-free and ENIG, with selection based on component pitch, storage, assembly method and design priority.

Capability information

  • HASL lead-free for many standard FR4 PCB applications.
  • ENIG for fine-pitch components, flatter pads and longer shelf-life requirements.
  • Other finish requests can be reviewed with design and sourcing requirements.
FinishBest fitCommon applications
HASL lead-freeGeneral PCB fabrication and straightforward ordersIndustrial controls, LED boards, power supply PCB
ENIGFine-pitch assembly, flat pads and shelf lifeMedical, IoT, wearable and multilayer PCB
Project-specific finishSpecial assembly or customer requirementsOEM programs and qualified production builds

Application examples

Fine-pitch modules, connectors, BGA pads, prototype PCB, low volume PCB and production electronics.

inquiry tip

Specify the required finish in your inquiry and mention assembly constraints such as fine-pitch parts or storage time.

Surface finish FAQ

Which surface finish should I choose?

Choose based on assembly process, component pitch, shelf life, design priority and customer requirements.

Is ENIG suitable for fine-pitch PCB?

ENIG is commonly reviewed for fine-pitch assemblies because it provides a flatter pad surface.

Can finish affect lead time?

Yes. Finish availability and process requirements can affect inquiry and production scheduling.

Need help choosing PCB finish?

Send assembly notes and board files for review.

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